Description:

 Model 105 low temperature asher.

Features:

• Single wafer
• Single cassette
• Microprocessor controlled menu-driven
• Multi-step program (three steps + over etch) process program
• Wafer lift pin assembly (up and down)
• Temperature, gas flow, and substrate position
• Low temp processing eliminates thermal damage
• Independent control of pressure
• Self contained RF power supply
• Butterfly valve for more precise pressure control
• Phase magnitude detector to provide real-time RF impedance matching control
• Two mass flow controllers

Specifications:

• Setup for 3 - 6" wafers
• Brooks cassette handling system up to 150mm wafers
• Range for strip: 150C to 250C +/- 5C
• Range for descum: 70C to 150C +/- 5C