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EVG 620 Automated Mask Alignment System

Equipment: EVG 620 Automated Mask Alignment System
Manufacturer: EVG
Description:

 Known for its high level of automation and reliability, the EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. Volume production types and manual R&D systems are available. An ultra-soft wedge compensation together with a computer controlled contact force between the mask and wafer ensures that both yield and mask lifetime are dramatically increased while production costs are lowered. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput.


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EVG 610 Semi-automated Mask Alignment System

Equipment: EVG 610 Semi-automated Mask Alignment System
Manufacturer: EVG
Description:

 The EVG®610 is a highly flexible R&D system that can handle small substrate pieces and wafers up to 200 mm. The tool supports a variety of standard lithography processes, such as vacuum-, soft-, hard- and proximity exposure mode, as well as other specific applications, including bond alignment, nano imprint lithography (NIL) and micro contact printing. The system offers quick re-tooling with a conversion time of less than one minute, making it ideal for universities, R&D and small-volume production applications.


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