Equipment: KLA-Tencor 2131 Defect Inspection System Upgraded to 2132
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description:  The KLA-Tencor 2132 is a wafer defect inspection system.
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Equipment: KLA-Tencor 6220 Surfscan
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description:  This tool detects, counts, and sizes defects
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Equipment: KLA-Tencor Surfscan 6420 Inspection System
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description:  A surface inspection tool for unpatterned wafers. It accommodates wafer sizes: 100, 125, 150, and 200mm (round or rectangular substrates). The 6420 is a film surface analyzer System detects sub micron particles on polysilicon, tungsten, epitaxial and polished silicon.
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Equipment: KLA-Tencor FleXus FLX 2320
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description:  Thin-film stress measurement instrument that measures the changes in the radius of curvature of a wafer caused by the deposition of a stressed thin film.
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Equipment: KLA-Tencor P-10 Surface Profiler
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description: A computerized, highly sensitive surface profiler that measures roughness, waviness, step height, and other surface characteristics in a variety of applications.
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Equipment: KLA-Tencor P-2 Long Scan Profilometer
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description:  Long scan surface profilometer that measures roughness, waviness, and step height.
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Equipment: KLA-Tencor Surfscan 5500 Surface Particle Inspection Analyzer
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description:
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Equipment: KLA-Tencor FleXus FLX-2300
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description:  Thin-film stress measurement instrument that measures the changes in the radius of curvature of a wafer caused by the deposition of a stressed thin film.
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Equipment: KLA-Tencor AIT I In-Line Defect Inspection System
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description: Automated full water inspection system for detecting particles as small as 0.10 micrometers on bare silicon and patterned process wafers
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Equipment: Veeco Dektak 3ST Surface Profiler
Manufacturer: Veeco
Description: Surface profile measuring system.
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Equipment: KLA-Tencor P20H Long Scan Profiler
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description: Long scan profiler measurement tool.
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Equipment: KLA-Tencor UltraPointe CRS1010 Defect Review Station
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description:
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Equipment: KLA-Tencor 6100 Surfscan Analysis System
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description: Unpatterned wafer surface contamination analyzer
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Equipment: KLA-Tencor 7700 Wafer Inspection System (M)
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description:  Patterned / Unpatterned wafer inspection system.
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Equipment: KLA-Tencor Surfscan 7700 Wafer Inspection System
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description: A patterned and unpatterned wafer inspection and can accommodate wafers between 4" to 8".
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Equipment: KLA-Tencor Surfscan 7600 Particle Inspection System
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description:  A particle inspection tool - capable of up to 200mm wafers.
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Equipment: KLA-Tencor AIT I (8020)
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description: A double darkfield patterned wafer inspection tool.
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Equipment: Dektak IIA (Sloan)
Manufacturer: Dektak
Description: Surface Profile Measuring System, Capability up to 6".
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Equipment: InspecTech KIS 2000 Inspection System
Manufacturer: InspecTec
Description: An automatic inspection tool that inspects both sides of diced wafers for any chipping or cracking. It also monitors kerf chipping sizes, kerf width, misalignment, as well as the proximity of damages to the edges.
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Equipment: KLA-Tencor 6200 Surfscan Analysis System
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description:  Wafer surface contamination analyzer for unpatterned wafers.
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Equipment: KLA-Tencor 5200 Overlay Inspection System
Manufacturer: KLA-Tencor Equipment
Description:
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Equipment: August Technology / Nanometrics NSX-80 Automated Defect Inspection System
Manufacturer: Nanometrics
Description: Automated vision-based defect-inspection system performs 25,000 pass/fail quality wafer and die checks a day compared to manually screening and classifying a few thousand die per day.
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Equipment: Electroglas Xynetics 1034X Wafer Prober with Station
Manufacturer: Electroglas/Xynetics
Description: This tool is designed to provide a high throughput capacity. It features a temptronics 4 inch thermal Chuck and Miller temperature controller.
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Equipment: Dektak 3030 Surface Profiler
Manufacturer: Dektak
Description: Measures vertical features ranging in height from 131 micron to 50 angstroms on a variety of substrate surfaces.
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Equipment: KLA-Tencor Surfscan 6400 Film Surface Analysis System
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description: Film surface analysis system for detection of contaminating particles. Detects contaminating partciles on all surfaces even rough surfaces. Small particles on dielectrics, polysilicon, backside silicon and rough metal films can be detected and particles as small as 0.12 micro-meters can be located on polished silicon and epitaxial layers.
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Equipment: KLA-Tencor 5100XP Overlay Measurement System
Manufacturer: KLA-Tencor Equipment
Description: The KLA-Tencor 5100 XP system is a metrology tool which performs Overlay (misregistration), CD (optional), and Height measurements(optional) automatically on thin film semiconductor wafers. Measurements are made in three dimensions based on the Coherence Probe Metrology (CPM) technology.
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Equipment: Rudolph Research Auto EL III Ellipsometer
Manufacturer: Rudolph
Description: The Rudolph Ellipsometer AutoELIII allows measurement of the thickness and refractive index of one or two thin transparent films on a substrate.
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Equipment: Rudolph Research FE-IIID Focus Dual Wavelength Ellipsometer
Manufacturer: Rudolph
Description:  The FE III-D's advanced Focused Beam™ system uses dual wavelength technology to directly measure the sample with a small spot at multiple angles of incidence and at multiple wavelengths. This allows the system to define more variables, increasing the certainty of the results on complex multi-layer films.
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Equipment: Rudolph Research FE-III Focus Ellipsometer
Manufacturer: Rudolph
Description: The FE-III has fully automatic operation and a scanning stage. Unique optical and detection systems measure ellipsometric parameters over an angle range of 40 to 70 degrees simultaneously, giving more flexibility for measuring multiple film stacks. The scanning stage allows wafer uniformity to be evaluated rapidly. The system automatically calculates film thickness, index of refraction, and the extinction coefficient. Automatic or manual wafer loading; can be used with small pieces or full wafers up to 8” diameter.
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Equipment: Rudolph Research Auto EL IV Ellipsometer
Manufacturer: Rudolph
Description:  The AutoEl IV has automatic 3 wavelength operation and a scanning stage. Multiple wavelength operation gives this instrument more flexibility for meauring multiple film stacks. The scanning stage allows wafer uniformity to be measured. The system automatically calculates ellipsometric parameters, thickness, and index
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Equipment: Ultratech 1500 Big Field Projection Stepper
Manufacturer: Ultratech
Description:  An electronic focus system which permits more accuracte and repeatable substrate positioning in the focal plane, allowing the system to print 0.1um and 0.8um resolution geometry in a production mode.
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Equipment: ADE 8100 Microscan
Manufacturer: ADE Equipment , ADE
Description:  Measures wafer thickness, bow, warp, site flatness, and global flatness.
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Equipment: ADE UltraGage 9500
Manufacturer: ADE Equipment
Description:  Measures thickness, shape stress, global and site flatness.
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Equipment: ADE UltraScan 9300 Wafer Inspection System
Manufacturer: ADE Equipment , ADE
Description: Non-contact capacitive probe measurement with 10nm resolution, and 400 to 1000 microns wafer thickness range. It is capable of handling 100mm to 200mm wafers.
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Equipment: ADE UltraScan 9350 Wafer Inspection / Sorter System
Manufacturer: ADE Equipment , ADE
Description: Non-contact capacitive probe measurement with 10nm resolution, 400 to 1000 microns wafer thickness range. Capable of handling 100mm to 200mm wafers
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Equipment: KLA-Tencor Model AIT XP Darkfield Inspection System
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description:  This is an automated defection inspection tool.
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Equipment: KLA-Tencor HRP 320 High Resolution Profiler
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description: The HRP (High Resolution Profiler) series from KLA-Tencor provides a comprehensive automated surface metrology solution for in-line process control of CMP and etch.  
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Equipment: KLA-Tencor OmniMap RS100 Resistivity Mapping System
Manufacturer: KLA-Tencor Equipment
Description:  With the ability to measure materials such as polysilicon, copper, and bulk silicon substrates. System capable of running 200mm and 300mm wafers.
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Equipment: KLA-Tencor UV-1050 Thin Film Measurement System
Manufacturer: KLA-Tencor Equipment
Description: The UV-1050's field-proven pattern recognition, extensive analysis software, and high reliability add up to an advanced thin film measurement tool with the lowest cost of ownership in its class. Inventory: Two newly refurbished and ready to go No warranty $45,000 each
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Equipment: KLA-Tencor SP1-TBI Unpatterned Surface Inspection System
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description: KLA-Tencor's SP1 configured with KLA-Tencor's Trible-Beam Illumination (TBI).
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Equipment: KLA-Tencor RS55TC
Manufacturer: KLA-Tencor Equipment
Description:  OmniMap Four Point Probe Resistivity Mapping System 
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Equipment: KLA-Tencor Alpha Step 500 Profilometer
Manufacturer: KLA-Tencor / ADE , KLA-Tencor , KLA-Tencor Equipment
Description:
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Equipment: KLA Tencor RS35C Resistivity Mapping System
Manufacturer: KLA-Tencor Equipment
Description:
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Equipment: KLA-Tencor UV-1070 Thin Film Measurement System
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description: Refurbished to meet OEM Specifications - $70,000
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Equipment: KLA Tencor Surfscan SP1-DLS Wafer Surface Analysis System
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description: System set up for 200mm Edge Grip Handler. Cassette Open Handler System/SMIF/Dual Cassette. System refurbished to meet OEM Specifications.
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Equipment: KLA-Tencor 2135 Defect Wafer Inspection System with KLA-Tencor 2552 Review Station
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description: KLA-Tencor 2135 Defect Wafer Inspection System   System capable up for processing 200mm wafers Low contact chuck Pentium CPU with Windows NT Installed NT box option-direct link/direct SECS SECS II/GEM Communication Interface Capable Mercury Xenon Lamp Light level sensor with adjustable 2x Mag Tubes X/Y/Z drive/controller chassis and motion controller card High voltage electronics Granite stage Autofocus III with 200mm Collimating Lens Remote Power Distribution Panel Wafer handling module Cassette ergo loaders With: KLA-Tencor 2552 Review Station 90Mhz Pentium CPU 128 MB RAM 2.1 GB Disk Storage  19" Color User Interface Monitor 17" Color Defect Image Monitor Thin-wire Ethernet Interface Hardware for Image Digitization Four (4) Isolated and Four (4) Non-Isolated RGB Video Inputs   Multi-user UNIX Operating System Relational Database for Defect Data and Images  Window-Based User Interface  KLA Defect Analysis Applications Software   KLA Database Management Utilities 
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Equipment: KLA-Tencor FLX-5500 Automatic Thin Film Stress Measurement System
Manufacturer: KLA-Tencor , KLA-Tencor Equipment
Description: 150mm -200mm wafers capable with SMIF Loader Dual wavelength technology Measures all reflective films above 800A and all translucent films (oxides and nitrides) above 2000A Throughput of over 60 wph Detailed color radial film stress maps using up to 1250 points per scan Less than 15 seconds required to scan a 200mm wafer Range is 1x10ex7 dynes to 4x10ex10 dynes/cm2 Windows based software  
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Equipment: Estek WIS 8000/800
Manufacturer: Estek
Description: The Estek WIS 8000/800 Wafer Inspection System is designed to analyze substrates, films, and oxides. $5,000 each
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