The GaSonics 7104 tool is a batch plasma system. Processing is accomplished at low temperature, and is used for surface treatment, descum, and cleaning organic material such as photoresist from metal, silicon and other assemblies.
An automated single-wafer photoresist asher. It is designed as a flexible downstream plasma photoresist removal system for high-volume wafer fabrication.
A downstream photoresist removal system. A damage-free asher with closed loop temperature control. 5 - 8 inch (125mm-200mm) wafer capability. This tool comes with optional integrated SMIF by Asyst.
The GaSonics 7104 tool is a batch plasma system. Processing is accomplished at low temperature, and is used for surface treatment, descum, and cleaning organic material such as photoresist from metal, silicon and other assemblies.
The GaSonics 7104 tool is a batch plasma system. Processing is accomplished at low temperature, and is used for surface treatment, descum, and cleaning organic material such as photoresist from metal, silicon and other assemblies.
A downstream photoresist removal system. A damage-free asher with closed loop temperature control. 5 - 8 inch (125mm-200mm) wafer capability. This tool comes with optional integrated SMIF by Asyst.
The GaSonics PEP 3510A/A is a single wafer, versatile microwave downstream Ash/Clean system with a dual chamber for wafer processing. It supports both 150mm and 250mm wafers.
The GaSonics 7104 tool is a batch plasma system. Processing is accomplished at low temperature, and is used for surface treatment, descum, and cleaning organic material such as photoresist from metal, silicon and other assemblies.
An automated single-wafer photoresist asher. It is designed as a flexible downstream plasma photoresist removal system for high-volume wafer fabrication.
A downstream photoresist removal system. A damage-free asher with closed loop temperature control. 5 - 8 inch (125mm-200mm) wafer capability. This tool comes with optional integrated SMIF by Asyst.
The GaSonics PEP 3510A/A is a single wafer, versatile microwave downstream Ash/Clean system with a dual chamber for wafer processing. It supports both 150mm and 250mm wafers.
The GaSonics 7104 tool is a batch plasma system. Processing is accomplished at low temperature, and is used for surface treatment, descum, and cleaning organic material such as photoresist from metal, silicon and other assemblies.
The GaSonics PEP 3510A/A is a single wafer, versatile microwave downstream Ash/Clean system with a dual chamber for wafer processing. It supports both 150mm and 250mm wafers.
