ADE 351 Standard Controller

ADE - 351 - Standard Controller (2)

ADE 6034 Microsense a Metrology tool that measures: Wafer thickness total, Thickness variation (TTV), Flatness, bow and warp.

ADE 351 Standard Controller

ADE - 351 - Standard Controller (2)

ADE 6034 Microsense a Metrology tool that measures: Wafer thickness total, Thickness variation (TTV), Flatness, bow and warp.

Measures wafer thickness, bow, warp, site flatness, and global flatness.

Measures thickness, shape stress, global and site flatness. Multifunction dimensional measurements for 500 nm design rule. Supports 4" to 8" wafers..

Non-contact capacitive probe measurement with 10nm resolution, 400 to 1000 microns wafer thickness range. Capable of handling 100mm to 200mm wafers.

Non-contact capacitive probe measurement with 10nm resolution, 400 to 1000 microns wafer thickness range. Capable of handling 100mm to 200mm wafers.

Measures wafer thickness, bow, warp, site flatness, and global flatness.

Non-contact capacitive probe measurement with 10nm resolution, 400 to 1000 microns wafer thickness range. Capable of handling 100mm to 200mm wafers.

Non-contact capacitive probe measurement with 10nm resolution, 400 to 1000 microns wafer thickness range. Capable of handling 100mm to 200mm wafers.