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PhotoResist Stripper
Single Wafer
75-100 Millimeter

The GaSonics Aura 2000-LL Stripper is a single wafer loadlocked system, design to address the demands for ultra clean, damage free photoresist removal. This loadlock system utilizes proven components of the Aura 1000 system, including a highly reliable downstream microwave process.

Features

  • 8” process capabilities
  • Loadlock with cool-down station for processed wafer
  • Water-cooled chamber and lamp assembly
  • Manually adjustable power to lamps
  • Gas box, designed to hold four MFC’s
  • Downstream endpoint detection
  • Rear access with control panel for servicing

Product Specifications

Typical Process Parameters
Pressure 1.25 to 3.5 torr
Gas Flow O2 3.0-4.5 SLPM
Gas Flow N2 0.30-.45 SLPM
Lamp Time (variable) 15-30 sec.
Typical Process Results
Strip Rates 1.0-3.0µ/min. for 8” wafer photoresist
  1.6-4.0µ/min. for 6” wafer photoresist
  1.6-4.0µ/min. for 5” wafer photoresist
Uniformity <±10% for all wafer sizes
Repeatability ±10% (w-t-w)
Throughput >40 wph for 1.2µ PR
Particle Control < .1 p/cm2; 0.3µ in size
Damage Control <0.1volt CV-shift for 250Å oxide
Selectivities to underlying films >100:1
Dimensions
Stripper L=60” W=39” H=72”
Pump Cart L=37” W = 31” H=37”
Utilities
Vacuume 165 cfm
Exhasut >250 cfm
Process Gasses 2(4) MFC’s
Electrical Equipment 208V, 3 phase, 60 Hz 20A/phase
Weight 250 lbs., 112 kilograms
Applications
Bulk resist removal 1.65 cfm
High-dose implanted resist >250 cfm
Descum
Non-oxidizing metal processing

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GaSonics Technical Specifications

GaSonics Ashing Systems
Aura 1000
Aura 2000-LL
Aura 3010
IPC L3500
IPC L3510

GaSonics Plasma Etch
7100 Series

 

See our inventory GaSonics equipment available for purchase