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Category   >> Metrology - Test & Inspection System   >> ADE 8100 Microscan
Category   >> New Arrivals   >> ADE 8100 Microscan

ADE 8100 Microscan

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WaferCheck 8100 system automatically measures and sorts 100 to 200mm wafers High speed belted sorter Product Highlights: �� 10nm resolution �� 100, 125, 150 and 200mm wafers �� Thickness, flatness, bow, warp �� Program 40 sort classes �� SEMI standard measurement patterns �� NIST traceable thickness and resisitivity masters �� Worldwide measurement correlation �� Wafer slice, grind, lap and polish applications Flexible Configurations : �� Up to 6 senders, 24 receivers �� Optional measurements and stations: �� Prealigner �� Center thickness �� Thickness/flatness/bow/warp �� Modular design to meet specific process requirements �� Bulk resitivity �� Visual inspection �� Conductivity type
Productivity Options: �� RS232 ASC11 output �� DECnet/Ethernet interface �� SECS II/GEM protocol �� ReportTools application �� RecipeTools for setups �� MultiReport tool interconnect �� Device Toolbox �� FabVision integration Modular Configuration, Automated Operation The flexible WaferCheck systems can be incorporated into a variety of production and quality environments. Different configurations of WaferCheck 8100 systems are available to meet the measurement and sorting needs at each stop of the wafer production process. Systems configuration is modular with up to six senders and twenty-four receivers. The ASC2000 Controller provides menu based setup and operation, high speed data acquisition, analysis and reporting, and process flexibility.ADE WaferCheck 8100 & 8300 �� WaferCheck 8100 system automatically measures and sorts 100 to 200mm wafers High speed belted sorter Product Highlights: �� 10nm resolution �� 100, 125, 150 and 200mm wafers �� Thickness, flatness, bow, warp �� Program 40 sort classes �� SEMI standard measurement patterns �� NIST traceable thickness and resisitivity masters �� Worldwide measurement correlation �� Wafer slice, grind, lap and polish applications Flexible Configurations : �� Up to 6 senders, 24 receivers �� Optional measurements and stations: �� Prealigner �� Center thickness �� Thickness/flatness/bow/warp �� Modular design to meet specific process requirements �� Bulk resitivity �� Visual inspection �� Conductivity type
Productivity Options: �� RS232 ASC11 output �� DECnet/Ethernet interface �� SECS II/GEM protocol �� ReportTools application �� RecipeTools for setups �� MultiReport tool interconnect �� Device Toolbox �� FabVision integration Modular Configuration, Automated Operation The flexible WaferCheck systems can be incorporated into a variety of production and quality environments. Different configurations of WaferCheck 8100 systems are available to meet the measurement and sorting needs at each stop of the wafer production process. Systems configuration is modular with up to six senders and twenty-four receivers. The ASC2000 Controller provides menu based setup and operation, high speed data acquisition, analysis and reporting, and process flexibility.