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Non-Contact Capacitive Probe Measurement with 10nm Resolution, 400 to 1000 Microns Wafer Thickness Range, Capable of handling 100mm to 200mm Wafers. Capable of Measuring: Lapped, Etched, Polished and Patterned Wafers, Measures Bow and Warp, Site and Global Flatness, Thickness,
System Consist of : 2 Cassette input stations, 3 Cassette output stations, Pre-Aligner station, High Res Resistiy station, Flatness Station, Single end effector robot, Ultrascan Controller, 9300 power supply, 350 Arm Controller, Unix computer and Drive, ASC II, Teal Power Conditioner, Printer.
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408-654-9500
