Aluminum wedge wire bonder for low to high lead count devices with different configurations. Wedge stroke: Capable of clearing the protuberance 7.5mm high at maximum from the device surface. Overall bonding accuracy of 10um realized by the upgrading of both the pattern recognition and mechanical accuracy. Bonding Method: Ultrasonic (pull-cut) wedge bonding. Patern recognition time with-in 0.25sec (2-point alignment) Recognition Range XY:0.23mm Recognition accuracy: 3.7um Bonding Area X:20mm Y:20mm
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