Side Sputtering System Capable up to 6" Wafers - Three Target RF & DC Side Sputtering System With Etch MRC 603 Side Sputtering System Three Target RF & DC Side Sputtering System With Etch Three targets 5 in. x 15 in. Sputter etch capability Quartz substrate heaters, substrateTemperature adjustable to 400 deg. C. Substrate carrier 13 in. x 13 inCryo pump and roughing pump.Optional 3 kW 13.56 MHz RF generator10 kW DC Magnetron power supply adjustable to 850 V and 25A.