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AG Associates 8108 Heatpulse - Rapid Thermal Processor System
Features/Specifications:
- Single Wafer Processing Capability up to 8" Rapid Thermal Processor System,
- Standard End Effectors,
- 2 Cassette station Swivel,
- Cooling Station
- Wafer Aligner
- Robot with Controller
- Temperature Control
- DCP Pyrometer ATP #1 and #2
- 6-Gas Panel
- Precise Temperature / Time Control
- Multiple Cycle Processing
- Full SECS II Capability
- Steady State Temperature Range 400 to 1200°C
- Steady State Process Time Programmable: 0-600 Sec
- Ramp-up Rate Programmable: 10c/sec - 25c
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