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showing 1 - 9 of 9
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GaSonics 7104
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Automatic batch low temperature plasma system for surface treatment and cleaning of organize metallic and composite substrates and assemblies. 75mm-1500mm wafer capability
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Inquire
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GaSonics AE2001 Etch System
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Single wafer down-stream isotropic etch system:
Configurable for 75mm, 100mm, 125mm, and 150mm
Wafer Sizes - Front and backside etch
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Inquire
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GaSonics L3500
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Inquire
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Gasonics L3500(2)
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Inquire
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GaSonics L3500(3)
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Inquire
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GaSonics L3510 Single Wafer Ashing System
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8" Cassette Handling w/ Zbot Downstream Microwave Asher
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Inquire
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Technics 500-II Plasma System
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Low temperature plasma system is designed for production use in photoresist stripping of high resolution integrated circuits, organic ashing, surface cleaning and treatment. Chamber 9"W x 6"H x 8"D
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Inquire
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Tegal 903E Plasma Etch System
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Capability to Etch Vias and Contacts with Anisotropic or Sloped Profiles for Etching Silicon Dioxides, Silicon Nitrides and Polymides Tegal 903E Plasma Etch System Cassette to cassette single wafer plasma etcher system. 3" to 6" Wafer Capacity.
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Inquire
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ThermaWave Opti-probe 1600
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Therma-Wave Opti-Probe 1600, Film Measurement System for Multilayer Thick or Thin Films. System includes patern recognition. System can measure a film's reflectivity. Spatial averaging and and spectrometer regions displayed. Contour and 3D maps for all template measurements.Thick/Thin film calculations for non-absorbing films. 100/120V, 50/60Hz
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Inquire
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showing 1 - 9 of 9
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